07.12.2015  bis  09.12.2015



ACCOMODATION and GETTING THERE further down at this page!

Waferbond 2015 - Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration

You are invited to present your latest results in wafer bonding technologies and their application in microsystems technologies, to learn about how to use wafer bonding in complex technologies, get news about wafer bonding equipment as well as about testing of wafer bonded interfaces and finally meet your colleagues working in this field for fruitful discussion.

Focuses of this event are any kind of wafer bonding technologies such as semiconductor direct, anodic, glass frit, metallic and adhesive wafer boding as well as their usage in complex microsystems technologies like MEMS, MOEMS, and wafer level integration as for engineered substrates. Additional Topics will be characterization and qualification of wafer bonded devices and bonding process equipment.  


Conference program is online now:

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Social program

Monday 7th December 2015: »COME TOGETHER«


at TOURISTINFORMATION from 6.30 p.m. to 8.30 p.m.

- Snacks are available

- There will be no storage facilities for luggage

- After »come together« we are going to visit the Christmas market

Tuesday 8th December 2015: »MUSEUM & DINNER«

1st Day of WaferBond Conference


We will visit the »Staatliches Naturhistorisches Museum« at 5 p.m. The museum is next door to the conference location (Pockelsstraße 10).


After visiting the museum we will walk to the dinner location »Gastwerk« (Mittelweg 7).

Wednesday 9th December 2015: GUIDED LAB-TOUR (Fraunhofer IST)

2nd Day of WaferBond Conference


You will be transfered by taxi to Fraunhofer IST (Bienroder Weg 54 E, 38108 Braunschweig). The Lab-Tour will start at 4 p.m.

For more information including maps, adresses and bus / tram connections please see the PDF below:

  Map of locations_WaferBond_2015.pdf
[2.87 MB]


The conference will cover all aspects of bonding wafers and comparable substrates from basic research to industrial applications. Beside this general approach this year the focus will be on the following topics: 

  • Metal based Wafer Bonding Technologies
  • Temporary Wafer Bonding for Wafer Thinning and Thin Wafer Handling
  • Wafer Bonding in Northern Europe
  • Wafer Bonding in Industrial Processes: Processes Stability and Reliability
  • Enabling new Technologies and Devices for modern Applications by Wafer Bonding
  • The future of Wafer Bonding

Conference location & date

Conference location:

Haus der Wissenschaft

Pockelsstraße 11 | 38106 Braunschweig


Conference date: December 7th to 9th, 2015

Information for poster presentation

The postersize should not exceed the size DIN A1 (594 mm x 841 mm)

Deadline for paper submission

Abstracts (max. 200 words) should be submitted by July 1st, 2015, to roy.knechtel@xfab.com. The use of the abstract template is required. Authors will be informed of acceptance by August 15th, 2015.


Extended abstracts (2 pages) are due October 16th, 2015. Authors will again have the opportunity to publish a full paper in the Springer Journal Microsystem Technologies.


  2nd Call for Papers WaferBond15.pdf
[215.27 KB]

Source: Braunschweig Stadtmarketing GmbH

Sponsoring and Exhibition

Sponsoring this fine and small conference will offer your organization a unique opportunity for exposure within the international WaferBonding community.


We are pleased to offer you the following possibility for sponsoring:


Offer 1 „Sponsoring“:

This option includes an exhibition space and the presentation of your company on the WaferBond Conference (e.g. on the badges and the conference presentation) and also on a 1/2page b/w advert (DIN A6) in the book of abstracts.


Offer 2 „Tailored sponsoring packages“: Order on request.

This option includes mentioning your company as sponsor during a sponsored event, e.g. the Conference dinner, Come together, lunch, coffee break. If you have other suggestions for promoting your organization at this event, please do let the conference team know.


Further ideas and proposals could be discussed with Roy Knechtel or Dr. Marko Eichler.

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Marko Eichler

Local chair      

Tel. +49 (0) 531/2155-636

Email:    marko.eichler@ist.fraunhofer.de

Roy Knechtel

Technical chair 

Tel. +49 (0) 3 61/427 6584

Email:    roy.knechtel@xfab.com


Please visit our secure Accommodations Search and Booking System to book your accommodation:



Further rooms are available until 5th October 2015 (keyword is "Waferbond") at:


Advance Hotel

Mittelweg 7

38106 Braunschweig

phone: +49 531 / 390 770
fax: +49 531 / 390 77 399
email: info@advance-hotel.de



Singleroom with shower/Toilette: 87 Euro Room/Night inkl. breakfast and WLAN.


Getting there


From the North:

Highway A7 direction Kassel/Hannover until highway interchange A2 direction Berlin

From the East:

Highway A2 direction Magdeburg/Hannover/Dortmund until highway interchange Wolfsburg/Königslutter to A39 direction Braunschweig/Kassel

From the South:

Highway A7 direction Hannover/Hamburg until highway interchange Salzgitter highway A39 Wolfsburg/Berlin

From the West:

Highway A2 direction Hannover/Magdeburg/Berlin until the interchange Braunschweig Nord to A391 direction Braunschweig/Kassel/Salzgitter further to highway interchange Ölper to A392 direction city.


If you are using a navigation system to travel to the conference, please enter the following destination: Haus der Wissenschaft, Pockelsstraße 11, 38106 Braunschweig



The Deutsche Bahn will bring you almost to the doors of the conference. You will get train schedule information from the Deutsche Bahn travel service by calling +49 800-1507090 (free) or on the Deutsche Bahn AG website www.bahn.de.



The closest Airport to Braunschweig is the Hannover International Airport, a mere hour’s drive from Braunschweig (60 km). Besides, trains are running frequently between Hannover Airport and Hannover Main Station. The suburban railway line S5, running every 30 minutes between 4:30 a.m. and midnight, takes you from Terminal C to Hannover Main Station. From there you can take a train to Braunschweig Main Station. Another option is to have yourself picked up by a shuttle service that will take you to and from the airport in time. You can book this service with one of the following providers:

Alternatively you can fly directly to Braunschweig’s regional and R&D airport which is open to private, medium-sized jets.

  Map of locations_WaferBond_2015.pdf
[657.42 KB]

Sponsors of WaferBond 2015

Applied Microengineering LTD

EV Group (EVG)

SÜSS MicroTec AG

Okmetic Oyj



* Pflichtfelder

Art der Registrierung - Konferenz (8. und 9. Dezember 2015):

Teilnahme als:*
(*1) Frühbucherrabatt: Reduzierte Konferenzgebühr bei Buchungen bis zum 15. Oktober 2015. Ab dem 16. Oktober 2015 gilt automatisch der reguläre Tarif.
(*2) Für Studenten bis zu einem Alter von 27 Jahren (bitte gültigen Studentenausweis per Mail oder Fax an das Konferenzteam).
Bitte füllen Sie das Formular vollständig aus:

7. Dezember


8. Dezember


9. Dezember


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